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🔞欧美成人在线视频♌️新材料(liao)科技與化(hua)學技術創(chuang)新
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DSM帝(di)斯曼NeoRez R-985/R-986聚氨(an)酯分散體(ti)
産品說明(ming):用于金屬(shu)面漆,罩光(guang)清漆,手套(tao)塗料,皮革(ge)塗料;用作(zuo)含PVC或不含(han)的地闆面(mian)漆;與丙烯(xi)酸乳液一(yi)🙂↔️起用于塑(su)膠塗料。
發(fa)布時間:
2025-11-21
Dow Electronic Materials Introduces New Metallization and Imaging Products for Printed Circuit Boards
Unique Technology Helps Create Smaller, More Sustainable, Less Expensive Consumer Electronics.
Copper Gleam™ HV-101 & HV-606 Electrolytic Copper
Copper Gleam™ HV-101 and HV-606 electrolytic coppers are the latest offerings for panel plating in Vertical-in-Line equipment. They deliver high plating efficiency to improve productivity and reduce cost.
Copper Gleam™ HS-200 Electrolytic Copper from Dupont Dow Rhom Hass Company
The Copper Gleam™ HS-200 bath is a full bright acid copper plating process specifically formulated for use in conveyorized plating equipment with insoluble anode. Formulated for high current density plating, the process is capable of producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.
Circuposit™ 3000-1 from Dupont Dow Rhom Hass Company
Circuposit™ 3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.
BondFilm工(gong)藝介紹
通(tong)常來說,BondFilm工(gong)藝會将銅(tong)微蝕刻至(zhi)1.2 到1.5 µm的厚度(du),同時将銅(tong)表✡️面(200 - 300 A)轉化(hua)成期望的(de)有機-金屬(shu)結構。通過(guo)這個工🧑🏻❤️🧑🏼藝(yi)後😮💨,可見的(de)結果便是(shi)形成一個(ge)棕色的均(jun)勻鍍層。雖(sui)然銅的蝕(shi)刻會随着(zhe)🧑🏾🎄浸置時間(jian)而不斷進(jin)行,但是👧🏾實(shi)際上BondFilm粘附(fu)層的生長(zhang)是受自我(wo)限制的,在(zai)該層的形(xing)成和溶解(jie)達到平衡(heng)後,就會達(da)到了一個(ge)最大厚度(du)。
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