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··•··•2025-11-21 10:47
BondFilm® MS 800通(tong)過更(geng)低的(de)咬蝕(shi)量,提(ti)供可(ke)靠的(de)結合(he)力 & 熱(re)可靠(kao)性; 成(cheng)本更(geng)低。
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| Cu-surface-after-BondFilm-treatment-x-5000 | Reliable-sequential-build-up-with-BondFilm | Reliable-and-desired-brown-organo-metallic-surface-finish | Uniform-roughening-for-improved-adhesion |
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